General information | |
Type |
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Market segment | Mobile |
Family |
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CPU part number |
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Frequency | 600 MHz |
Bus speed | 100 MHz |
Clock multiplier | 6 |
Package |
Mobile Module MMC-2 4" x 2.5" (10.2 cm x 6.4 cm) |
Socket | 400-pin Mobile Module Connector 2 (MMC-2) |
Architecture / Microarchitecture | |
Microarchitecture | P6 |
Manufacturing process | 0.18 micron |
Data width | 32 bit |
The number of CPU cores | 1 |
The number of threads | 1 |
Floating Point Unit | Integrated |
Level 1 cache size |
16 KB instruction cache 16 KB data cache |
Level 2 cache size | on-die 256 KB 8-way set associative cache |
Features |
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Low power features |
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On-chip peripherals | 82443BX Host Bridge system controller with DRAM controller and PCI bus controller |
Electrical / Thermal parameters | |
V core |
1.6V (maximum performance mode) 1.35V (battery optimized mode) |
Minimum/Maximum operating temperature | 0°C - 100°C |
Minimum power dissipation |
1.35 Watt (Deep Sleep mode, PMM60002001AA) 1.96 Watt (Deep Sleep mode, all others) |
Thermal Design Power | 16.6 Watt (typical) |
Notes on Intel Pentium III Mobile module 600 MHz | |
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