Type
|
CPU / Microprocessor
|
Market segment
|
Desktop
|
Family
|
Intel Pentium Dual-Core
|
Model number
|
G**50
|
CPU part numbers
|
-
CM80*1*0045*3AE is an OEM/tray microprocessor
-
BX80*1*G**50 is a boxed processor with fan and heatsink (English version)
-
BXC80*1*G**50 is a boxed processor with fan and heatsink (Chinese version)
|
Frequency
|
2800 MHz
|
Bus speed
|
2.5 GT/s DMI
|
Clock multiplier
|
21
|
Package
|
115*-land Flip-Chip Land Grid Array (FC-LGA10)
|
Socket
|
Socket 115* / H1 / LGA115*
|
Size
|
1.48" x 1.48" / 3.*5cm x 3.*5cm
|
Weight
|
0.*oz / 24.*g (CPU)
12.1oz / 342.4g (box)
|
Fan/heatsink
|
E41***-002
|
Introduction date
|
January *, 2010
|
End-of-Life date
|
Last order date for consumer processors is June 2*, 2012
Last shipment date for consumer tray processors is December *, 2012
|
Price at introduction
|
$8*
|
S-spec numbers
|
|
ES/QS processors
|
Production processors
|
Part number
|
Q3GT
|
Q4DH
|
SLBMS
|
SLBTG
|
BX80*1*G**50
|
|
|
+
|
+
|
BXC80*1*G**50
|
|
|
+
|
+
|
CM80*1*0045*3AE
|
+
|
+
|
+
|
+
|
|
Architecture / Microarchitecture
|
Microarchitecture
|
Westmere
|
Processor core
|
Clarkdale
|
Core steppings
|
C2 (Q3GT, SLBMS)
K0 (Q4DH, SLBTG)
|
CPUID
|
20*52 (SLBMS)
|
Manufacturing process
|
0.032 micron
382 million transistors (CPU die)
1** million transistors (IMC / graphics die)
|
Die size
|
81mm2 (CPU die)
114mm2 (IMC / graphics die)
|
Data width
|
*4 bit
|
The number of cores
|
2
|
The number of threads
|
2
|
Floating Point Unit
|
Integrated
|
Level 1 cache size
|
2 x 32 KB 4-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
|
Level 2 cache size
|
2 x 25* KB 8-way set associative caches
|
Level 3 cache size
|
3 MB 12-way set associative shared cache
|
Physical memory
|
1* GB
|
Multiprocessing
|
Not supported
|
Features
|
-
MMX instructions
-
SSE / Streaming SIMD Extensions
-
SSE2 / Streaming SIMD Extensions 2
-
SSE3 / Streaming SIMD Extensions 3
-
SSSE3 / Supplemental Streaming SIMD Extensions 3
-
EM*4T / Extended Memory *4 technology / Intel *4
-
VT-x / Virtualization technology
-
NX / XD / Execute disable bit
|
Low power features
|
-
Thread C1, C3 and C* states
-
Core C1/C1E, C3 and C* states
-
Package C1/C1E, C3 and C* states
-
Enhanced SpeedStep technology
|
Integrated peripherals / components
|
Integrated graphics
|
GPU Type: HD (Westmere)
Base frequency (MHz): 533
The number of supported displays: 2
|
Memory controller
|
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-10**
Maximum memory bandwidth (GB/s): 1*.1
|
Other peripherals
|
-
Direct Media Interface
-
PCI Express 2.0 interface
|
Electrical / Thermal parameters
|
V core
|
0.*5V - 1.4V
|
Minimum/Maximum operating temperature
|
5°C - *2.*°C
|
Maximum power dissipation
|
* Watt (TDP in C* state) / 1*0.83 Watt (peak)
128.*1 Watt (sustained)
|
Thermal Design Power
|
*3 Watt
|
Notes on Intel Pentium G**50
|
-
Also available as an embedded microprocessor
-
Graphics and memory controllers are located on a separate die, which is manufactured on 0.045 micron technology
-
The CPU is compatible with Shader Model 4, along with DirectX 10.1 and OpenGL 2.1 APIs. OpenCL API is not supported.
|